Name: UV Release Tape Low Energy | Wafer Grinding | UV Dicing Tape
Availability: InStock

Used with UV light exposure (with certain wavelength), the adhesion is greatly reduced
(irreversible reaction), the object is then easily removed/ picked up after operation.
Good for dicing and heat resistant purposes.
Used in wafer grinding, chip dicing, MLCC cutting, LED dicing, lens cutting, substrate cutting, lead frame cutting, LED frame cutting or name plate cutting.
Anti-static version is available.
Low energy release, speed up the production process.

Model	Material	Physical Property			Applications
UPT143LE	PO Film + Liner	Total Thickness	170	µm	Dicing, grinding, great expansion
		Before UV release	2.5	kg/in
		After UV release	0.03	kg/in
UPT152LE	PO Film + Liner	Total Thickness	172	µm	Dicing, grinding, great expansion Lead frame cutting
		Before UV release	1.8 ↑	kg/in
		After UV release	0.03 ↓	kg/in
UPT805LE	PO Film + Liner	Total Thickness	86	µm	Dicing, great expansion
		Before UV release	0.5~0.9	kg/in
		After UV release	0.015↓	kg/in
UPT104LE	PO Film + Liner	Total Thickness	125	µm	Dicing, grinding, great expansion Lead frame cutting
		Before UV release	1.3 ↑	kg/in
		After UV release	0.02 ↓	kg/in

UV Release Tape Low Energy

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