- Main applications are for protection or carrier.
- Provides enough holding adhesion during dicing operation at regular temperature, objects are not moved, nor flying. Easily released after heating.
- Thermal release temperature：85℃, 90℃, 120℃, 150℃, 190℃ or the highest temperature 260℃.
- For wafer dicing, chip dicing, sputtering process, MLCC dicing, LED dicing, substrate cutting, lens cutting, nameplate cutting or any semiconductor Industry production process.
| Model | Material | Physical Property | Temp. | ||
| FCL70810-1 | PET Film w/ Liner | Total thickness | 150 ± 8 | um | Release Temperature 85℃ , 3-5 min |
| Adhesion Before Heating |
0.6 ↑ | kg/in | |||
| Adhesion After Heating |
0.015 ↓ | kg/in | |||
| FCL70950 | PET Film w/ Liner | Total thickness | 95 ± 5 | um | Release Temperature 90℃ , 3-5 min |
| Adhesion Before Heating |
0.4-0.7 | kg/in | |||
| Adhesion After Heating |
0.015 ↓ | kg/in | |||
| FCL90980-1 | PET Film w/ Liner | Total thickness | 125 ± 7 | um | Release Temperature 100℃ , 3-5 min |
| Adhesion Before Heating |
1.2 ↑ | um | |||
| Adhesion After Heating |
0.015 ↓ | kg/in | |||
| FCL125-6 | PET Film w/ Liner | Total thickness | 130 ± 7 | um | Release Temperature 120℃ , 3-5 min |
| Adhesion Before Heating |
1.0 ↑ | kg/in | |||
| Adhesion After Heating |
0.015↓ | kg/in | |||
| FCL71538-6 | PET Film w/ Liner | Total thickness | 91 ± 5 | um | Release Temperature 150℃ , 3-5 min |
| Adhesion Before Heating |
0.4 ↑ | kg/in | |||
| Adhesion After Heating |
0.015↓ | kg/in | |||
| FCL72010 | PET Film w/ Liner | Total thickness | 150 ± 8 | um | Release Temperature 200℃ , 3-5 min |
| Adhesion Before Heating |
0.3 ↑ | kg/in | |||
| Adhesion After Heating |
0.015↓ | kg/in | |||
