Application
Automatable geometry gauge for thin 150mm and 200mm silicon wafers.

The MX204-8-21-V works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 21 measuring points it controls thickness, bow and warp after back side grinding. Throughput at least 80 wafers per hour. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT Software.

Measurement type
Thickness | Flatness (TTV)

Application
Automatable geometry gauge for 150mm and 200mm silicon wafers.

The MX204-8-37 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 37 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.

Measurement type
Thickness | Flatness (TTV)

Application
Easy one-point thickness gauge for 30–200mm silicon wafers.

The MX301 is a robust and stable instrument for quick and simple manual thickness gauge of a large variety of silicon wafers. Adaptable to different thickness ranges within a few seconds. With customized exchangeable shims and an easy one-click calibration. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type
Thickness

Application
Easy one-point thickness gauge for 30–200mm semiconducting and metallic materials.

The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display.Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type
Thickness

Application
Easy one-point thickness gauge for 75–300mm semiconducting and metallic materials.

The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type
Thickness

Application
Easy one-point thickness gauge for thin, framed 200mm and 300mm silicon wafers.

The MX3012 is a robust and stable instrument for quick and simple manual thickness gauge. Especially for thin wafers, unframed and framed with dicing tape or backgrind tape. Simple handling without the tape thickness nor the tape’s dielectric constant. Light barriers avoid mismeasurement at the edges. Fully self-calibrating without the need for gauge blocks nor reference wafers. Integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type
Thickness