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MX 601
Application
Fast contactless resistivity gauge for semi-insulating wafers up to 150mm.The MX601 gauges resistivity of wafers made of semi-insulating materials like Gallium Arsenide or Silicon Carbide. Fast handling without wafer preparation and excellent repeatability with best avoidance of piezo-electric effects. MX601’s serial interface allows data evaluation and statistics, as well as access to calibration constants and output types.
Measurement type
Thickness -
MX 6012
Application
Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.The MX6012 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. In addition to the center measurement, up to 15 additional points for each half scan can defined. Optionally an identical scan after 90° rotation. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness -
MX 604
Application
Fast contactless resistivity gauge for silicon blocks.The MX604 gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4
different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface. Our optional software EHMaster allows further evaluation of the measurements and configuration
of the tool.
Measurement type
Thickness -
MX 604-B
Application
Portable contactless resistivity gauge for silicon blocks.The MX604-B gauges resistivity of silicon blocks of any size with the reliable eddy current method. It allows connecting up to 4 different sensor probes (alternatively) to measure different resistivity ranges. Integrated alphanumeric display. Powered by rechargable battery. With energy-saving automatic stand-by mode. Intended as portable stand-alone version of MX604.
Measurement type
Thickness -
MX 604-S
Application
Fast sheet resistance gauge for 50–200mm silicon wafers and conductive films.The MX604-S gauges sheet resistance of semiconducting wafers and conductive films on high-ohm substrates with the reliable eddy current method. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness | Sheet resistance -
MX 604-ST
Application
Combined thickness and resistivity gauge for up to 156mm solar wafersThe MX604-ST is designed to characterize solar wafers. Fits square wafers up to 156mm and round wafers from 2″ to 200mm. It combines sensors for measuring thickness and resistivity simultaneously. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness | Resistivity -
MX 608
Application
Combined thickness and resistivity gauge for 150mm and 200mm silicon wafers.The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness -
MX 7012
Application
High resolution thickness and surface profiler for as-sawn 450mm silicon wafers.The MX7012 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Measurement type
Thickness -
MX 7018
Application
The MX7018 is designed to control thickness, flatness (TTV), warp, waviness and roughness after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and roughness are measured simultaneously. (The latter with an opto-electronic measuring system.) Available asin-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.
Measurement type
Thickness -
New BSL CMP Pad Conditioner
- Strong diamond holding force : Chemical reaction + Mechanical contact
- Corrosion resistance : Carbide interface between diamond & bond material
- Longer lifetime : Utilization of edges by diamond face
- Maximized diamond chip pocket by high diamond exposure
- Excellent conditioning efficiency and pad debris removal rate
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Nikon Reticle Case
● Product name：Nikon Reticle Case
● Part number：NR-C150
● Dimension：186(L) x 213(W) x 37(H)mm
● Weight：380g
● Capacity：1 PCS
● Mask size：6025 Mask(6 inch)
● Material：ABS、AL -
OHT Reticle SMIF Pod / RSP150
● Product name：OHT Mask Automated Transfer Box
● Part number：RSP-CKPP-O
● Dimension：229.8mm (L) x 227.3mm (W) x 91.8mm (H)
● Weight：1340g
● Capacity：1 PCS
● Mask size：6025 Mask(6 inch)
● Material：PEEK