Application
High-resolution thickness and flatness (TTV) gauge for 150–200mm silicon wafers
Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX102-8 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV).
A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer. One such profile consists of 200 local thickness
values and is offset by 45 degrees relative to the neighbouring profile. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV)
| Wafer Diameter | 150mm, 200mm |
| Accuracy | ±0.1 µm |
| Resolution | 10nm |
| Spartial resolution | 1mm |
| Scans | 4 |
| Software | MXNT |
| MX 102-6 | MX 102-8 | MX 1012 | MX 1018 | |
| Wafer Diameter | 4“, 5“, 6“ | 6“, 8“ | 8″, 12″ | 12″, 18″ |
| Accuracy | ±0.1 µm | ±0.1 µm | ±0.1 µm | ±0.3 µm |
| Resolution | 10nm | 10nm | 10nm | 10nm |
| Spartial Resolution | 1mm | 1mm | 1mm | 1mm |
| Scans | 4 | 4 | up to 8 | up to 8 |
| Dynamic Range | 100 or 350µm | 100 or 350µm | 100 or 350µm | 100 or 350µm |
| Software | MXNT | MXNT | MXNT | MXNT |
