| Wafer Diameter | 100mm, 125mm, 150mm |
| Accuracy | ±0.6 µm |
| Resolution | 50nm |
| Thickness range | 100 – 700 µm |
| Automatic wafer | no |
| Bow & Warp include gravity connection | no |
| Software | MXNT |
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MX 203-6-33-B
Application
Fast contactless geometry gauge for thin 100–150mm silicon wafers.
High throughput: the MX203-6-33-B gauges with its 33 measuring points every wafer within max. 7 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp
