| Wafer Diameter | 50mm, 75mm, 100mm |
| Accuracy | ±0.5 µm |
| Resolution | 50nm |
| Thickness range | 200 – 800 µm |
| Automatic wafer | no |
| Software | MXNT |
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MX 203-4-21
Application
Fast contactless geometry gauge for 2–4″ silicon wafers.
High throughput: the MX203-4-21 gauges with its 21 measuring points every wafer within max. 5 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp
