300mm FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate. 25 slots type uses for general wafer. 13 slots type can store glass carrier and Thin wafer.
India Handotai H300/H313 FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, 300 FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.
India Handotai could customize the product depends on customer’s requirements on different manufacturing process.
| Wafer Type | Standard Version Wafer | Thin Wafer | ||
| Process Type | General Process | Low Moisture Absorption Material | General Process | |
| Model | H300-S1 | H300-L1 | H313-S1 | H313-S2 |
| Capacity | 25 slot | 25 slot | 13 slot | 13 slot |
| Weight | 5.6kg | 6.2kg | ||
| Main Material | PC ESD | CBM ESD | PC ESD | PC ESD |
| Rear Window | See Through Window | Black Window | See Through Window | Black Window With Back Support |
| Temperature Tolerance | ≦ 80°C | ≦ 80°C | ||
| Inflatable Raft Distance | 160x250mm | 160x250mm | ||
| RUN CARD | v | v | v | v |
| RFID | v | v | v | v |
| Wafer Type | Thin Wafer | |||
| Process Type | General Process | Low Moisture Absorption Material | High Temperature Process | |
| Model | H313-S3 | H313-L1 | H313-L2 | CK313HT |
| Capacity | 13 slot | 13 slot | 13 slot | 13 slot |
| Weight | 6kg | 5kg | 6kg | 6.6kg |
| Main Material | PC ESD | CBM ESD | CBM ESD | PEI ESD |
| Rear Window | See Through Window With Back Support | Black Window | Black Window With Back Support | ESD Removable Airtight Black Window |
| Temperature Tolerance | ≦ 60°C | ≦ 80°C | ≦ 80°C | ≦ 150°C |
| Inflatable Raft Distance | 160x250mm | 160x260mm | ||
| RUN CARD | v | v | v | x |
| RFID | v | v | v | x |


















