Name: High Temperature FOUP IH300 13slot (300mm / 12 inch) for thin wafer - India Handotai
Availability: InStock

300mm FOUP, Able to protect, deliver and store 300mm wafer, provide safe protection during delivery and storage. Reduce particle contamination of wafer, protect wafer from static electricity damage and then increase yield rate. 25 slots type uses for general wafer. 13 slots type can store glass carrier and Thin wafer.

India Handotai H300/H313 FOUP series of product line fully align with SEMI standard of automation interface, compatible with AMHS. Not only design for standard silicon wafer, but also for special thin wafer application, 300 FOUP create mini-environment to protect valuable wafer for transfer and storage purpose.

300mm FOUP – front

300mm FOUP – back

FOUP Door Key

FOUP CKH313 (13 slot)

FOUP CKH313
13 slot Back Support

FOUP CKH300 (25 slot)

India Handotai could customize the product depends on customer’s requirements on different manufacturing process.

Wafer Type	Standard Version Wafer		Thin Wafer
Process Type	General Process	Low Moisture Absorption Material	General Process
Model	H300-S1	H300-L1	H313-S1	H313-S2
Capacity	25 slot	25 slot	13 slot	13 slot
Weight			5.6kg	6.2kg
Main Material	PC ESD	CBM ESD	PC ESD	PC ESD
Rear Window	See Through Window	Black Window	See Through Window	Black Window With Back Support
Temperature Tolerance	≦ 80°C		≦ 80°C
Inflatable Raft Distance	160x250mm		160x250mm
RUN CARD	v	v	v	v
RFID	v	v	v	v

Wafer Type	Thin Wafer
Process Type	General Process	Low Moisture Absorption Material		High Temperature Process
Model	H313-S3	H313-L1	H313-L2	CK313HT
Capacity	13 slot	13 slot	13 slot	13 slot
Weight	6kg	5kg	6kg	6.6kg
Main Material	PC ESD	CBM ESD	CBM ESD	PEI ESD
Rear Window	See Through Window With Back Support	Black Window	Black Window With Back Support	ESD Removable Airtight Black Window
Temperature Tolerance	≦ 60°C	≦ 80°C	≦ 80°C	≦ 150°C
Inflatable Raft Distance	160x250mm			160x260mm
RUN CARD	v	v	v	x
RFID	v	v	v	x