Application
High-resolution thickness and flatness (TTV) gauge for 300–450mm silicon wafers.
Easy adaptation to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible.
The MX1018 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV).
A pair of capacitive sensors samples four radial profiles (45 degrees) on each wafer which consist of hundreds of local thickness values. If necessary for your application, the four standard scans can be simply increased to achieve an even higher measuring coverage. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV)
| Wafer Diameter | 200mm, 450mm |
| Accuracy | ±0.1 µm |
| Resolution | 10nm |
| Spartial resolution | 1mm |
| Scans | up to 8 |
| Software | MXNT |
| MX 102-6 | MX 102-8 | MX 1012 | MX 1018 | |
| Wafer Diameter | 4“, 5“, 6“ | 6“, 8“ | 8″, 12″ | 12″, 18″ |
| Accuracy | ±0.1 µm | ±0.1 µm | ±0.1 µm | ±0.3 µm |
| Resolution | 10nm | 10nm | 10nm | 10nm |
| Spartial Resolution | 1mm | 1mm | 1mm | 1mm |
| Scans | 4 | 4 | up to 8 | up to 8 |
| Dynamic Range | 100 or 350µm | 100 or 350µm | 100 or 350µm | 100 or 350µm |
| Software | MXNT | MXNT | MXNT | MXNT |
