| Wafer Diameter | 200, 300 mm |
| Thickness | 600 – 900 μm |
| Max. Warp | 100 μm |
| Resistivity | 0.001 – 200 Ohm·cm |
| Type check | 0.020 – 200 Ohm·cm |
| Software | EHMaster |
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MX 6012
Application
Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.
The MX6012 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. In addition to the center measurement, up to 15 additional points for each half scan can defined. Optionally an identical scan after 90° rotation. To be connected to a PC via serial interface. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement type
Thickness
