MX 203-8-37

Application

Fast contactless geometry gauge for 150mm and 200mm silicon wafers.

High throughput: the MX203-6-33 gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp. Wafer stress evaluation is optionally available. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software

Measurement type

Thickness | Flatness (TTV) | Bow | Warp