Product Features
| Wafer Diameter | 125mm, 150mm, 200mm |
| Accuracy | ±2.0 µm |
| Resolution | 75nm |
| Thickness range | 200 – 800 µm |
| Automatic wafer | no |
| Bow & Warp include gravity connection | no |
| Software | MXNT |
MX 203-58-37-B
Application
Fast contactless geometry gauge for thin 125– 200mm silicon wafers.
High throughput: the MX203-58-37-B gauges with its 37 measuring points every wafer within max. 8 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp
