MX 2013

Application

Automatable geometry gauge for thin and standard 200mm or 300mm silicon wafers.

The MX2013 works as semi-automated stand-alone station. With its 37 measuring points it gauges 300mm wafers within 50 seconds. It controls thickness, bow and warp in high resolution (Corresponds with Sori). System optional available for 200mm wafer measuring. Comes with our powerful MX-NT operating Software.

Measurement type

Thickness | Flatness (TTV)