Product Features
| Wafer Diameter | 300mm, 450mm |
| Warp Accuracy | ±5 µm + 5% of reading |
| Warp Precision | ±0.5 µm + 1% of reading |
| Warp range | 800 µm |
| Automatic wafer geometry gauge | yes |
| Software | MXNT |
MX 2018-W
Application
Automatable bow and warp gauge for 450mm silicon wafers.
The MX2018-W manages the difficult 450mm size wafers. Upright position measuring avoids the otherwise enormous gravity-induced sag. With its 73 measuring points it controls center thickness, bow and warp in high resolution. For covering all geometry properies we recommend using MX2018-W in combination with MX1018. Within a robot sorter these both modules can measure two wafers simultaneously without detraction of the throughput. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV)
