MX 301-8

Application

Easy one-point thickness gauge for 30–200mm silicon wafers.

The MX301 is a robust and stable instrument for quick and simple manual thickness gauge of a large variety of silicon wafers. Adaptable to different thickness ranges within a few seconds. With customized exchangeable shims and an easy one-click calibration. With integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.

Measurement type

Thickness

Category:

Product Features

Wafer Diameter up to 200mm
Thickness Accuracy ±0.5µm
Resolution 10nm
Dynamic range 800µm
Thickness range default 200 – 1000 µm
Switchable to measure high res material yes
Software EHMaster