| Wafer Diameter | up to 300mm |
| Thickness Accuracy | ±0.5µm |
| Resolution | 10nm |
| Dynamic range | 800µm |
| Thickness range | default 200 – 1000 µm |
| Switchable to measure high res material | Yes |
| Software | EHMaster |
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MX 3012
Application
Easy one-point thickness gauge for 75–300mm silicon wafers.
The MX3012 is a robust and stable instrument for quick and simple manual thickness gauge of a large variety of silicon wafers. Adaptable to different thickness ranges within a few seconds. With an easy one-click calibration. Integrated 5-digit display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Measurement type
Thickness
