| Work piece size | Maximum ２００ｍｍ×２００ｍｍ (Contact us if you want to handle more than 200mm） |
| Scanning method | XY scanning or Rotation scanning |
| Inspection time | Φ２００ｍｍ（Ｘ－Ｙ）Approx. 4min Φ２００ｍｍ（Θ） Within 2min Φ１５０ｍｍ（Θ） Within 1min 30sec Φ１００ｍｍ（Θ） Within 1min |
| Work piece setting | Robot transfer (Back or edge sucking by vacuum) |
| Dimension | Ｗ１,５３０ｍｍ×Ｄ１,３００ｍｍ×Ｈ１,９０３ｍｍ |
| Weight | Approx. 1,000 Kg |
| Power Consumption | Approx. 2.0KW (1000V) |
| Target substrate | Silicon wafer, Transparent substrate, Sapphire substrate, LT wafer, SiC wafer, etc |
| Maximum sensitivit | Transparent substrate 0.2μｍ Silicon wafer 0.1μｍ |
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YPI-MX Series (Automated Transfer)
ＹＰＩ－ＭＸ－ＸＹＡ／ＹＰＩ－ＭＸ－ΘＡ
Glass substrate/ Sapphire wafer surface inspection system.
YPI-MX series（Auto loading type）
Specialized to tune for a transparent substrate. Apply to measure a rough polishing of back of substrate.
