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  • CHALLENGE 300 Series
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    CHALLENGE 300 Series

    Synthetic Grinding Fluids

    Application areas:

    • Wafer thinning and backgrinding (BG)
    • Substrate cropping, squaring, and sawing
    • Precision dicing and edge grinding
    • Glass, optics, and ceramic part slicing
    • Solar wafer slicing and surface prep



    5-gallon pails | 55-gallon drums

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  • MERCURY 1000
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    MERCURY 1000

    Synthetic Grinding Fluid

    Application areas:

    • Wafer thinning and backgrinding (BG)
    • Substrate cropping, squaring, and sawing
    • Precision dicing and edge grinding
    • Glass, optics, and ceramic part slicing
    • Solar wafer slicing and surface prep



    5-gallon pails | 55-gallon drums

    Request Quote
  • TENSOR HTD Series
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    TENSOR HTD Series

    Dicing/Back-Grinding Coolants/Lubricants with Anti-Corrosion and ESD Suppression Additives

    Application areas:

    • Wafer thinning and backgrinding (BG)
    • Substrate cropping, squaring, and sawing
    • Precision dicing and edge grinding
    • Glass, optics, and ceramic part slicing
    • Solar wafer slicing and surface prep
    Request Quote
  • VECTOR HTG
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    VECTOR HTG

    Synthetic Grinding Fluids

    Application areas:

    • Wafer thinning and backgrinding (BG)
    • Substrate cropping, squaring, and sawing
    • Precision dicing and edge grinding
    • Glass, optics, and ceramic part slicing
    • Solar wafer slicing and surface prep



    5-gallon pails | 55-gallon drums

    Request Quote

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