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Candeo™ Post-CMP Cleaning Chemistry
Advanced Defect Reduction. Increased Yield. Proven Integration.
Application:
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Processes using Alumina (Al₂O₃) or Silica (SiO2)-based slurries and challenging contamination profiles
- Silicon and Silicon Carbide (SiC) CMP processes
- Advanced packaging and device manufacturing
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Custom PCMP Cleans
Synthetic Grinding Fluids
Application areas:
5-gallon pails | 55-gallon drums -
TENSOR D-Rinse
Additive For High Pressure Pad Rinse/Wafer De-Chucking Cycles
Tensor D-Rinse is a specially formulated additive designed for use in high-pressure pad rinse and wafer de-chucking systems of today’s CMP tools.
Application areas:
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TENSOR DG Series
Cleaning Solutions for IC Manufacturing
TENSOR DG Series Products are aqueous detergents formulated to facilitate the removal of organic and inorganic films, combinations of films, particles and debris from the surface of the substrate. When the correct TENSOR DG Series Product is selected, corrosion/oxidation of films and/or interconnect structures is eliminated.
Application areas: