| Wafer Diameter | 100-200mm |
| Accuracy | ±0.6 µm |
| Resolution | 50nm |
| Thickness range | 150 – 650 µm |
| Automatic wafer | no |
| Bow & Warp include gravity connection | no |
| Software | MXNT |
Roll over image to zoom in
MX 203-8-49-B
Application
Fine mesh contactless geometry gauge for thin 100 – 200mm silicon wafers.
High throughput: the MX203-8-37-B gauges with its 49 measuring points every wafer within max. 12 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV) | Bow | Warp
