| Wafer Diameter | 100mm, 150mm, 200mm |
| Accuracy | ±0.5 µm |
| Resolution | 75µm |
| Thickness range | 400 – 900 µm |
| Automatic wafer geometry gauge | yes |
| Software | MXNT |
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MX 204-48-37
Application
The MX204-48-37 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 37 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV)
