| Wafer Diameter | 125mm, 150mm (100mm is optional) |
| Accuracy | ±0.6 µm |
| Resolution | 50nm |
| Thickness range | 100 – 700 µm |
| Automatic wafer geometry gauge | yes |
| Bow & Warp include gravity connection | no |
| Software | MXNT |
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MX 204-6-33
Application
The MX204-6-33 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 33 measuring points it controls thickness, bow and warp in high resolution. Wafer stress evaluation is optionally available. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.
Measurement type
Thickness | Flatness (TTV)
