CHALLENGE 557-S

Slurry Additive for Cerium and Alumimun Oxide Polishing Slurries

Application areas:

  • Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
  • Diamond polishing of hard crystalline materials
  • Precision optics surface finishing
  • Planarization for advanced packaging
  • Loose abrasive and fixed abrasive processes



5-gallon pails | 55-gallon drums

Challenge 557-S is an aqueous based slurry additive designed to be added to cerium oxide and aluminum oxide polishing slurries to eliminate light scratching and increase removal rate. Additionally, the nature of polishing slurries and their sub-micron particle sizes creates post-polish cleaning issues. High precision optical parts may be polished to the correct specifications using standard slurries but cleaning the slurry particles from the surface of the parts is difficult and can result in damaged or rejected parts. Adding CHALLENGE 557-S to the polishing slurry allows for that slurry to be more easily cleaned from the glass or ceramic surface. Also, CHALLENGE 557-S eliminates staining issues and burnishing marks. CHALLENGE 557-S may also be used with other polishing slurries for similar results.

Typical Applications:


Polishing applications using cerium oxide and aluminum oxide slurries for Precision Optics, Ophthalmic Lenses, Flat Panel Display materials, Glass Disks, and other precision polished parts.

Typical Properties:


  • pH – 12.0
  • Conductivity Ms – 6.1
  • Specific Gravity – 1.01

Directions:


CHALLENGE 557-S is used at a concentration of between 2-3% by volume of slurry. Add CHALLENGE 557-S to the pre-mixed slurry. The slurry will be ready for immediate use.

Suspension-Type Lapping Vehicles


  • Viscous, biodegradable polymer/surfactant blends that fully suspend abrasives like alumina and silica
  • Engineered for semiconductor substrates, ceramics, and optics
  • Maintain suspension and dispersion over long intervals, reducing the need for constant mixing

Our suspension-type lapping slurries, including those in the Vector HTS Series, are biodegradable, viscous polymer/surfactant blends designed to disperse and suspend abrasives like aluminum oxide and silicon dioxide when mixed with de-ionized water. Engineered for the lapping of semiconductor substrates, these slurries fully disperse and suspend abrasive material for extended periods of time with relatively little change in physical or chemical characteristics. Designed for use on all types of lapping plates and tool-sets.

Products within the HTS series have varied chemical and physical properties, resulting in differences in wetting, film strength and viscosity. This allows the formulation to be optimized for any application.

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