CHALLENGE 550 Series-HT

Non-Suspension Type Lapping/Polishing Slurry Additive for Recirculating Systems

Application areas:

  • Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
  • Diamond polishing of hard crystalline materials
  • Precision optics surface finishing
  • Planarization for advanced packaging
  • Loose abrasive and fixed abrasive processes



5-gallon pails | 55-gallon drums

Challenge 550-HT was developed for use in “high-speed recirculating” slurry application during lapping and polishing processes. Utilizing the energy of a high speed circulating pump, standard on most lapping machines, it evenly disperses aluminum oxide, cerium oxide, silicon carbide, boron carbide, and garnet abrasive. It also reduces abrasive usage by eliminating “hard-packing” of the abrasive in the slurry tank and the slurry lines. Using CHALLENGE 550-HT will also produce cleaner parts making the downstream cleaning line more efficient.

Typical Applications:


Single and double sided lapping/polishing for recirculating systems

Typical Properties:


  • pH – 10.0
  • Conductivity Ms – 0.3
  • Specific Gravity – 1.02

Directions:


CHALLENGE 550-HT is used at approximately 3- 5% (by weight) with deionized (DI) water or tap water that is not excessively hard. After CHALLENGE 550-HT is mixed with the water in the slurry tank, add the abrasive. The slurry will be ready for use almost immediately. Start grain loading 400 g/liter for a one-meter machine. Flow rate for the slurry should be approximately 300ml/minute for a one-meter machine.

Suspension-Type Lapping Vehicles


  • Viscous, biodegradable polymer/surfactant blends that fully suspend abrasives like alumina and silica
  • Engineered for semiconductor substrates, ceramics, and optics
  • Maintain suspension and dispersion over long intervals, reducing the need for constant mixing

Our suspension-type lapping slurries, including those in the Vector HTS Series, are biodegradable, viscous polymer/surfactant blends designed to disperse and suspend abrasives like aluminum oxide and silicon dioxide when mixed with de-ionized water. Engineered for the lapping of semiconductor substrates, these slurries fully disperse and suspend abrasive material for extended periods of time with relatively little change in physical or chemical characteristics. Designed for use on all types of lapping plates and tool-sets.

Products within the HTS series have varied chemical and physical properties, resulting in differences in wetting, film strength and viscosity. This allows the formulation to be optimized for any application.

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