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Candeo™ Post-CMP Cleaning Chemistry
Advanced Defect Reduction. Increased Yield. Proven Integration.
Application:
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Processes using Alumina (Al₂O₃) or Silica (SiO2)-based slurries and challenging contamination profiles
- Silicon and Silicon Carbide (SiC) CMP processes
- Advanced packaging and device manufacturing
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CHALLENGE 300 Series
Synthetic Grinding Fluids
Application areas:
5-gallon pails | 55-gallon drums -
CHALLENGE 543-HT
Lapping/Polishing Slurry Additives for Suspending Non-Treated Abrasive
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
5-gallon pails | 55-gallon drums -
CHALLENGE 550 Series-HT
Non-Suspension Type Lapping/Polishing Slurry Additive for Recirculating Systems
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
5-gallon pails | 55-gallon drums -
CHALLENGE 557-HT
Non-Suspension Type Lapping/Polishing Slurry Additive for Recirculating Systems
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
5-gallon pails | 55-gallon drums -
CHALLENGE 557-S
Slurry Additive for Cerium and Alumimun Oxide Polishing Slurries
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
5-gallon pails | 55-gallon drums -
CHALLENGE 700-HT
Additives for Post-Lap/Polish Rinse and In-Process Wet Storage of Parts
CHALLENGE 700-HT is a synthetic formulation developed for the rinsing and wet storage of lapped/polished parts.
Application areas:
5-gallon pails | 55-gallon drums -
CHALLENGE 800 Series
Aqueous Detergents For Ultrasonic/Megasonic Cleaning
CHALLENGE 800 Series Products are water-based, ultrasonic/megasonic detergents formulated to increase the cavitational energy released upon substrate surfaces for more effective cleaning.
Application areas:
5-gallon pails | 55-gallon drums -
Custom CMP Slurries
Fully formulated slurries made to your specifications
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
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Custom PCMP Cleans
Synthetic Grinding Fluids
Application areas:
5-gallon pails | 55-gallon drums -
MERCURY 1000
Synthetic Grinding Fluid
Application areas:
5-gallon pails | 55-gallon drums -
TENSOR D-Rinse
Additive For High Pressure Pad Rinse/Wafer De-Chucking Cycles
Tensor D-Rinse is a specially formulated additive designed for use in high-pressure pad rinse and wafer de-chucking systems of today’s CMP tools.
Application areas:
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TENSOR DG Series
Cleaning Solutions for IC Manufacturing
TENSOR DG Series Products are aqueous detergents formulated to facilitate the removal of organic and inorganic films, combinations of films, particles and debris from the surface of the substrate. When the correct TENSOR DG Series Product is selected, corrosion/oxidation of films and/or interconnect structures is eliminated.
Application areas:
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TENSOR HTD Series
Dicing/Back-Grinding Coolants/Lubricants with Anti-Corrosion and ESD Suppression Additives
Application areas:
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TENSOR HTD Series
Dicing/Back-Grinding Coolants/Lubricants with Anti-Corrosion and ESD Suppression Additives
Application areas:
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VECTOR HTC-SCA Series
Ultrasonic/Megasonic Detergents
VECTOR HTC-SCA Series are water-based detergents formulated to increase the cavitational energy released upon the substrate surface by ultrasonic or megasonic apparatus. The products are designed for more effective cleaning of post-lapped, post-etched and post-polished substrates.
Application areas:
5-gallon pails | 55-gallon drums
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VECTOR HTG
Synthetic Grinding Fluids
Application areas:
5-gallon pails | 55-gallon drums -
VECTOR HTI-1.1
Synthetic Cooolant/Lubricant for Silicon Cropping, Sawing, and Edge-Grinding in Non-Recirculating Applications
VECTOR HTI-1.1 is a synthetic formulation developed for use in “once-through” processes using diamond blades or diamond wires.
Application areas:
5-gallon pails | 55-gallon drums
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VECTOR HTR
Additive for Rinsing Silicon Wafers — Post-Lapping/Polishing, Sawing and Texturing
VECTOR HTR is a synthetic formulation developed for the rinsing and wet storage of substrates after lapping, polishing, sawing or texturing.
Application areas:
5-gallon pails | 55-gallon drums -
VECTOR HTS Series
Vector HTS Series Products are biodegradable, viscous, polymer/surfactant mixtures formulated to be used with Aluminum Oxide (either PWA type or FO Type) and de-ionized water to form a suspension-type lapping slurry.
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
5-gallon pails | 55-gallon drums -
VECTOR Series C-E Diamond Slurries
C-E Diamond Slurry Developed Specifically for Silicon Carbide
VECTOR Series C-E Diamond Slurries are aqueous, synthetic formulations developed to optimize material removal rate (MRR, see Figure 1a below) and surface finish (Figure 1b-c and Figure 2) when polishing silicon carbide (SiC) with a pad.
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
1-gallon bottles | 2.5-gallon bottles | 5-gallon pails | 55-gallon drums -
VECTOR TXT
Removal Rate Enhancing Base for Diamond Slurry Production
VECTOR TXT is a base material which allows manufactures of hard crystalline materials the advantage of making their own diamond slurry for optimum performance in polishing process.
Application areas:
- Substrate lapping for silicon, SiC, GaAs, InP, and LiNbO₃
- Diamond polishing of hard crystalline materials
- Precision optics surface finishing
- Planarization for advanced packaging
- Loose abrasive and fixed abrasive processes
2½ gallon bottles | 5-gallong pails | 55-gallon drums | 275-gallon totes