CHALLENGE 700-HT

Additives for Post-Lap/Polish Rinse and In-Process Wet Storage of Parts

CHALLENGE 700-HT is a synthetic formulation developed for the rinsing and wet storage of lapped/polished parts.

Application areas:

  • Post-lap and post-polish wafer cleaning
  • Post-dicing and singulation rinse
  • CMP and PCMP cleaning
  • Ultrasonic/megasonic tank cleaning for optics and semiconductors
  • FPD glass and solar wafer cleaning
  • Wet storage and pre-bond prep



5-gallon pails | 55-gallon drums

CHALLENGE 700-HT minimizes scratching from in-process handling; protects parts from staining; and prevents hard-to-clean particles from adhering to the part surface for more effective downstream cleaning.

Also recommended for the rinsing/washing of lapping plates, CHALLENGE 700-HT removes process debris from both the plate’s surface and grooves, thereby preventing the formation of iron oxide/abrasive particle aggregates that can dislodge and cause scratching.

When used for rinsing/washing polishing pads, CHALLENGE 700-HT prevents staining; increases pad life by keeping the pore structure open; and reduces the frequency of pad conditioning.

Directions


CHALLENGE 700-HT is used at dilutions ranging from 2%-3%, depending on the condition and type of lapping equipment being used and the workpiece.

  • Evaluation should begin at 2% with deionized or tap water. It is fed into the rinse line and flooded over the lapping surface either before the parts are placed on the plate, or after lapping is completed.
  • After the lapping plate has been lifted, 700-HT should be flooded over the surface. This breaks the surface tension between the parts and the plate, and removes any remaining swarf, which could cause scratching and complicate handling.
  • Parts can then be removed, rerinsed and stored in 2% 700-HT bath.
  • For polishing applications follow the same dilution guidelines.

Ultrasonic & Megasonic Cleaning


  • Aqueous detergents designed for ultrasonic and megasonic equipment
  • Remove fine particles and residues without damaging substrates
  • Formulated for sensitive materials like optics, high-index glass, ceramics, and semiconductors

Certifications


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