CMP Products are abrasive slurries made of tightly sized, ultra-high purity, 50-200 nm size metal-oxide particles. The slurries are optimized by application and formulated for compatibility with the materials being polished and optimal removal rate and selectivity. Particles dispersed in a special polymer matrix with wetting agents and flow control additives for optimal stability and easy removal after the CMP process is complete.
Have a CMP application that requires expert assistance?
Our team can help you with a customized solution that addresses:
- Low volume applications requiring a customer solution
- Obsolescence of currently qualified products
- Importation challenges or US sourcing requirements
Our process
Intersurface Dynamics has access to the CMP technology lab at our sister company Entrepix.
This allows us to screen potential CMP consumables and processes directly on customer wafers and deliver a turn-key process to our customers supported by meaningful application data.
Our quality lab is also equipped to provide all analyses expected for sensitive semiconductor applications. These measurements include: trace metals by ICP-OES, pH and conductivity, viscosity, and particle size measurements by request.
Off-the-Shelf products include the Vector TXT Slurry Base which is used as received and blended with customer supplied diamond and is the most versatile and economical solution. Vector CE Diamond Slurries can be purchased premixed with diamond.
Custom CMP Slurries
- Fully formulated slurries for Chemical Mechanical Planarization (CMP)
- Tailored for advanced semiconductor devices and packaging
- Available with custom abrasive systems, pH control, and surface modifiers
Certifications
