These products are designed to be diluted with water at levels between 2-5% resulting in extremely safe, economical and environmentally sensitive solutions to difficult cleaning problems.

TENSOR DG Series Products may be used in processes employing passivation rinses, brush cleaning, spray cleaning, ultrasonic and megasonic cleaning (heated or unheated). The products may be used in combination with existing cleans to make the process more robust.

TENSOR DG Series applications include post-CMP, passivation rinses, CMP buff, post–etch/ash cleaning, post–etch/ash rinsing, and wherever surfaces need to be cleaned or rinsed prior to the additional processing.

Characteristics

Product	pH @ 4%	Process Application	Suitable for Metal	Foam
DG 12	11.8	Ultra/Megasonic	Barrier/Capacitor/ILD	High
DG 12-LF	12.0	Ultra/Mega/Brush/Spray	Barrier/Capacitor/ILD	Low
DG 12-LM	11.5	Ultra/Mega/Brush/Spray	Barrier/Capacitor/ILD	Low
DG 10	10.2	Ultra/Megasonic	Barrier/Capacitor/ILD	High
DG 10-LF	9.5	Ultra/Mega/Brush/Spray	Barrier/Capacitor/ILD	Low
DG 10-LM	10.3	Ultra/Mega/Brush/Spray	Barrier/Capacitor/ILD	Low
DG 7	6.5	Ultra/Megasonic	Cu/Al/W/ILD	High
DG 7-LF	7.4	Ultra/Mega/Brush/Spray	Cu/Al/W/ILD	Low
DG 7-LM	5.9	Ultra/Mega/Brush/Spray	Cu/Al/W/ILD	Low
DG 7-Cu	7.0	Ultra/Mega/Brush/Spray	Cu/Al/W/ILD	Med
DG 7-Al	7.0	Ultra/Mega/Brush/Spray	Cu/Al/W/ILD	Med
DG 3	3.7	Ultra/Megasonic	Cu/Al/W/ILD	High
DG 3-LM	3.4	Ultra/Mega/Brush/Spray	Cu/Al/W/ILD	Low

Directions

It is recommended that evaluation of TENSOR DG Series Products begin at a dilution of 4% mixed with deionized (DI) water. The type and degree of residue to be removed varies from process to process and these factors will ultimately determine specific use instructions. Other factors to consider include wafer exposure time, temperature and equipment.