Epoxy Molding Material

KMC series

KMC series, Shin-Etsu Chemical’s semiconductor encapsulation material, is an epoxy molding compound which is using by advanced technology through development of silicone, and is a transfer molding material for encapsulation of various electronic components.
KMC series are having excellent low stress and low warpage, as well as high heat resistance and high thermal conductivity.
Shin-Etsu supply highly reliable encapsulation materials not only for general semiconductors device but also for large in-vehicle power modules and various sensor applications.