The slurries are suspended for easy application from the slurry tank to the workpiece via a peristaltic pump. Slight agitation is required prior to use, while constant, low-speed mixing is recommended during run cycles.
Figure 1. a) MRR in microns per hour, b) Average Roughness (Ra) in angstroms (Å), and c) Maximum Peak-to-Valley Roughness (Rmax) in Å of SiC using 0-2 μm or 2-4 μm, polycrystalline diamond. Results are typical of SiC wafers polished on PR Hoffman Servo RS Series machines fitted with Suba 800 pads.
Typical Properties:
- pH – 7.9
- Conductivity mS/cm – 4.6
- Specific Gravity – 1.03
Figure 2. Typical profilometric scans of SiC surface after 1 h polish with Vector Series C-E Diamond Slurry using a) 0-2 μm or b) 2-4 μm diamonds.
Directions:
VECTOR Series C-E Diamond Slurries are designed for use as received. The flow rate is determined by the size and configuration of the pad.
Diamond Polishing Systems
- Thixotropic vehicles for dispersing diamond abrasives, ideal for hard crystalline materials like SiC, sapphire, and GaN
- Available as base vehicles or ready-to-use slurries with diamond powder
- Deliver reduced scratching, improved cut rate, and flatter surfaces—while simplifying post-lap cleanup
Benefits of Vector TXT and CE Diamond slurries include flatter wafers with reduced damage, cut-rate enhancement, reduced scratching, reduced abrasive usage, stain prevention and more consistent results. Additionally, because the products are water soluble, post-lap cleaning is much easier. Lapping vehicles are also compatible with all other Intersurface Dynamics products.
Certifications
